Ultra-thin pure copper mSATA NGFF 5030 msata3.0 solid state drive SSD heat sink cooling vest

Size: 40mmX26mm（For more sizes, please browse directly in the store）

Prices are single prices 

This ultra-thin heat sink is specially designed for heat dissipation in notebooks and some narrow spaces.Pure copper（401W/mk）Relatively pure aluminum（237W/mk）With higher thermal conductivity, the heat sink exchanges heat through contact with the air, which can dissipate heat faster, Most of the heat dissipation in the marketsheetThe product is aluminum alloy, aluminum alloy is not easy to deform, easy to oxidize and easy to color, but the thermal conductivity is lower than that of pure aluminum. For example, the thermal conductivity of 6061 alloy aluminum is only 155W/mK, which can be searched by Baidu; in addition, through the so-called coating（Such as silver plating）Unable to increase its overall vertical thermal conductivity,The heat transfer path goes through layer by layer,On the contrary, the colored layer on the surface will lower its thermal conductivity, which is equivalent to that the colored layer wraps the entire heat sink, and the heat dissipation becomes slower. The plating silver（Or other plating）The outside is wrapped in black with an upper layer. Isn’t this heat insulation anymore?
If the thermal conductivity of aluminum alloy can be increased from more than 100 to more than 500 by plating, then can the heat sink be made of plastic and other materials to be more cost-effective than aluminum? Anyway, a little coating on the surface can increase the thermal conductivity by several hundred.If feasible, the market has already been widely adopted,The pure copper radiator, water-cooled drain cold head, etc. has long been replaced by this.Really good wordsWouldn''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''t such a process be adopted by large manufacturers such as Kyushu Fengshen and Cooler Master for high-end heat dissipation? Wouldn''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''t there be so many manufacturers of aluminum heat sinks that would not plate them to increase profits?In the endIf there is silver plating, you can slightly polish or scrape the part to expose the silver to oxidize in the moist air, and see if it will turn black. The oxidized silver is black.

Precautions before buying: 1. Please use a ruler to measure the length and width of the mSATA solid-state drive chip, whether it is almost matched with 40mmx26mm. 2. The space above the hard disk chip also needs to be measured whether it is sufficient. This heat sink is sold in thicknesses of 2mm, 3mm, and 4mm, and whether it will withstand other components after attaching the heat sink. 3. Please confirm whether the hard disk chips are all on the same level. You can use a straightedge to lean on all the chips to see if all the chips are in full contact with the straightedge. If there is a clear gap between the individual chips and the straightedge, it is recommended to choose heat dissipation. The sheet +laird thermal pad can fill the gap adaptively by relying on the soft compressibility of the laird thermal pad itself; You can also choose our ST922 thermal conductive glue to apply thick and thin paste according to the gap size.4.About the broken groove design is to increase the surface area for heat dissipation（Increase the area in contact with air）, The thicker the heat sink, the deeper the groove, the greater the surface area（The surface area of ??the broken groove is increased several times compared with that of a pure plane）, The better the heat dissipation effect is. This is actually the same as the groove in the CPU water block. The denser the groove in the cold head, the larger the surface area, so that the contact area with water will be larger.（When the water flows through, the heat is transferred from the copper to the water）Therefore, the more heat is taken away by the water flowing through in a unit time, the faster the temperature will drop. The air mentioned above is equivalent to the water flowing through the cold head.

About the effect of the heat sink: This mainly depends on the size of the space near the hard disk, air circulation, and whether there are other heating elements nearby.（Especially notebooks）It will affect the temperature. In addition, the main function of the heat sink is to heat up. For example, to prevent the main control chip from instantaneously high temperature, it can quickly dissipate the heat of a local high temperature point, and will not gather on a chip for a long time to make the surface Relatively lower temperature（Infrared temperature gun can test the surface temperature）, Has a certain buffering effect on the high temperature of the chip, and indirectly plays a protective effect.

2mm thickness:

3mm thickness:

4mm thickness:

Choose the heat sink with adhesive option, just tear off the blue film on the back and stick it on

If you choose the option of heat sink +laird thermal pad, you will also get a strap for wrapping and fixing the heat sink on the SSD (the blue film does not need to be torn off during use), so that the Laird thermal pad can fully and closely contact each chip for heat conduction. The specific method is as shown in Figure 3; the heat sink is also easy to remove, and there is no need to worry about sticking to the chip to remove the damaged particles.

Note:The thickness of the laird thermal pad is about 1.0mm and can be compressed to 0.5mm or less. Please pay attention to its thickness when using the machine with a small space; the thermal pad is very soft and has a certain viscosity, and its filling and heat conduction effect is much stronger than that of viscosity Thermally conductive double-sided adhesive, suitable for high heat requirements.